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SPAKDSP311VL150

SPAKDSP311VL150

SPAKDSP311VL150

NXP USA Inc.

CPLD DSP56K/Symphony Series SPAKDSP311 196-LBGA

SOT-23

SPAKDSP311VL150 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 196-LBGA
Supplier Device Package 196-MAPBGA (15x15)
Operating Temperature-40°C~105°C TJ
PackagingTray
Published 2005
Series DSP56K/Symphony
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Type Fixed Point
Base Part Number SPAKDSP311
Interface Host Interface, SSI, SCI
Voltage - I/O 3.30V
Non-Volatile Memory ROM (576B)
Voltage - Core 1.80V
On Chip Data RAM 384kB
Clock Rate150MHz
RoHS StatusROHS3 Compliant
In-Stock:3243 items

SPAKDSP311VL150 Product Details

SPAKDSP311VL150 Overview


It is a type of electronic component available in package 196-LBGA.Tray is the packaging method provided.Fixed Point members are well suited for a wide range of applications.The mounting of the device is done in the direction of Surface Mount.The operation of the device at the temperature of -40°C~105°C TJ ensures the normal operation of the device.The digital voltage range of 3.30V refers to the voltage that can be input or output.The DSP56K/Symphony series includes this digital signal processor.The base part number SPAKDSP311 can be used to identify many associated parts.

SPAKDSP311VL150 Features


Supplied in the 196-LBGA package

SPAKDSP311VL150 Applications


There are a lot of NXP USA Inc. SPAKDSP311VL150 DSP applications.

  • Digital communications
  • Audio synthesis
  • Spectral density estimation
  • Telephone conversations
  • Biomedical engineering
  • Automatic analysis system of EEG or ECG
  • Video coding, audio coding
  • Sonar
  • Computers and laptop
  • Medical imaging

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