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MSC8103VT1100F

MSC8103VT1100F

MSC8103VT1100F

NXP USA Inc.

CPLD StarCore Series MSC8103 332-BFBGA, FCBGA

SOT-23

MSC8103VT1100F Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 332-BFBGA, FCBGA
Operating Temperature-40°C~105°C TJ
PackagingTray
Published 2008
Series StarCore
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Type SC140 Core
Reach Compliance Code unknown
Base Part Number MSC8103
Interface Communications Processor Module (CPM)
Voltage - I/O 3.30V
Non-Volatile Memory External
Voltage - Core 1.60V
On Chip Data RAM 512kB
Clock Rate275MHz
RoHS StatusROHS3 Compliant
In-Stock:4323 items

MSC8103VT1100F Product Details

MSC8103VT1100F Overview


In electronic terms, it is a type of component that comes in the package of type 332-BFBGA, FCBGA .The packaging way is Tray.With its association with SC140 Core, it is suitable for a wide range of applications.The device is attached in a way that faces Surface Mount.If it is operating at the temperature of -40°C~105°C TJ, then it will be operating normally.This refers to the analog voltage range that can be input or output from 3.30V.The StarCore series contains this digital signal processor.The base part number MSC8103 can be used to identify many associated parts.

MSC8103VT1100F Features


Supplied in the 332-BFBGA, FCBGA package

MSC8103VT1100F Applications


There are a lot of NXP USA Inc. MSC8103VT1100F DSP applications.

  • Monitoring equipment
  • Electronic information engineering
  • Image signal processing
  • Smart camera
  • Fourier transform
  • Voice recognition
  • Tomography technology
  • Digital camera
  • Digital communications
  • Scene analysis technology

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