Name: MPC8270ZQMIBA
Brand: NXP USA Inc.
SKU: MPC8270ZQMIBA
Availability: InStock

Technical Specifications

Parameter Name	Value
Type	Parameter
Factory Lead Time	12 Weeks
Package / Case	516-BBGA
Surface Mount	YES
Operating Temperature	0°C~105°C TA
Packaging	Tray
Series	MPC82xx
Published	1997
JESD-609 Code	e0
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	516
ECCN Code	3A991.A.2
Terminal Finish	Tin/Lead/Silver (Sn/Pb/Ag)
HTS Code	8542.31.00.01
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	245
Supply Voltage	1.5V
Terminal Pitch	1mm
Time@Peak Reflow Temperature-Max (s)	30
Base Part Number	MPC8270
JESD-30 Code	S-PBGA-B516
Supply Voltage-Max (Vsup)	1.6V
Power Supplies	1.53.3V
Supply Voltage-Min (Vsup)	1.45V
Speed	333MHz
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR, RISC
Core Processor	PowerPC G2_LE
Clock Frequency	266MHz
Bit Size	32
Address Bus Width	32
Boundary Scan	YES
Low Power Mode	NO
External Data Bus Width	64
Format	FLOATING POINT
Integrated Cache	YES
Voltage - I/O	3.3V
Ethernet	10/100Mbps (3)
Number of Cores/Bus Width	1 Core 32-Bit
Graphics Acceleration	No
RAM Controllers	DRAM, SDRAM
USB	USB 2.0 (1)
Additional Interfaces	I2C, SCC, SMC, SPI, UART, USART
Co-Processors/DSP	Communications; RISC CPM
Length	27mm
Height Seated (Max)	2.55mm
RoHS Status	Non-RoHS Compliant

MPC8270ZQMIBA Product Details

MPC8270ZQMIBA Description

Utilizing Our HiPerMOS7 0.13-micron process technology, the next generation PowerQUICC II MPC8270ZQMIBA offers a range of performance, feature enhancements, and package options with lower power requirements. Ideal for wired and wireless infrastructure communications processing tasks, enhancements to the PowerQUICC II MPC8270ZQMIBA offers system designers a high degree of integrated features and functionality and compelling, proven architecture.