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MPC5125YVN400

MPC5125YVN400

MPC5125YVN400

NXP USA Inc.

ROMless e300 32-Bit Microcontroller MPC51xx Series MPC5125 1.4V 324-BBGA

SOT-23

MPC5125YVN400 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 324-BBGA
Surface MountYES
Operating Temperature-40°C~125°C TJ
PackagingTray
Series MPC51xx
Published 2002
JESD-609 Code e2
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 324
ECCN Code 3A991.A.2
Terminal Finish Tin/Silver (Sn/Ag)
HTS Code8542.31.00.01
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.4V
Terminal Pitch1mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MPC5125
JESD-30 Code S-PBGA-B324
Qualification StatusNot Qualified
Supply Voltage-Max (Vsup) 1.47V
Power Supplies1.43.3V
Supply Voltage-Min (Vsup) 1.33V
Oscillator TypeExternal
Number of I/O 64
Speed 400MHz
RAM Size 32K x 8
Voltage - Supply (Vcc/Vdd) 1.08V~3.6V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Core Processor e300
Peripherals DMA, WDT
Clock Frequency 35MHz
Program Memory TypeROMless
Core Size 32-Bit
Connectivity CANbus, EBI/EMI, Ethernet, I2C, USB OTG
Bit Size 32
Has ADC NO
DMA Channels YES
PWM Channels NO
DAC Channels NO
ROM Programmability FLASH
Length 23mm
Height Seated (Max) 2.55mm
Width 23mm
RoHS StatusROHS3 Compliant
In-Stock:185 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$29.72000$29.72
10$27.41200$274.12
25$26.18000$654.5
300$22.33000$6699

MPC5125YVN400 Product Details

MPC5125YVN400 Description

Designed for telematics systems and high temperature industrial applications, the MPC5125 32-bit embedded controller is a device from Freescale Semiconductor's mobileGT family containing the e300 Power Architecturetechnology core. This core complies with the Power Architecture embedded category, and maintains binary compatible with other processors in the mobileGT product family such as the MPC5121e and MPC5200B. It offers a robust system performance with a smaller package size, while bringing you the reliability and familiarity of the proven Power Architecture technology. An ecosystem of third-party vendors is available to help simplify and speed system design. This document provides an overview of the MPC5125 microcontroller features, including the major functional components.



MPC5125YVN400 Features


? e300 Power Architecture processor core (enhanced

version of the MPC603e core), operates as fast as

400 MHz

? Low power design

? Display interface unit (DIU)

? DDR1, DDR2, low-power mobile DDR (LPDDR),

and 1.8 V/3.3 V SDR DRAM memory controllers

? 32 KB on-chip SRAM

? USB 2.0 OTG controller with ULPI interface

? DMA subsystem

? Flexible multi-function external memory bus (EMB)

interface

? NAND flash controller (NFC)

? LocalPlus interface (LPC)

? 10/100Base Ethernet

? MMC/SD/SDIO card host controller (SDHC)

? Programmable serial controller (PSC)

? Inter-integrated circuit (I2

C) communication

interfaces

? Controller area network (CAN)

? J1850 byte data link controller (BDLC) interface

? On-chip real-time clock (RTC)

? On-chip temperature sensor

? IC Identification module (IIM)

MPC5125YVN400 Applications


? Telematics

? Industrial automation

? Avionics

? Robotics

? Motion control

? Utilities / Power Management

? Medical instrumentation


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