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MK10DN512VMD10

MK10DN512VMD10

MK10DN512VMD10

NXP USA Inc.

512KB 512K x 8 FLASH ARM® Cortex®-M4 32-Bit Microcontroller Kinetis K10 Series MK10DN512 3.3V 144-LBGA

SOT-23

MK10DN512VMD10 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 13 Weeks
Mounting Type Surface Mount
Package / Case 144-LBGA
Surface MountYES
Operating Temperature-40°C~105°C TA
PackagingTray
Series Kinetis K10
Published 2002
JESD-609 Code e1
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 144
ECCN Code 3A991.A.2
Terminal Finish TIN SILVER COPPER
HTS Code8542.31.00.01
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 3.3V
Terminal Pitch1mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MK10DN512
JESD-30 Code S-PBGA-B144
Qualification StatusNot Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies1.8/3.3V
Supply Voltage-Min (Vsup) 1.71V
Oscillator TypeInternal
Number of I/O 104
Speed 100MHz
RAM Size 128K x 8
Voltage - Supply (Vcc/Vdd) 1.71V~3.6V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Core Processor ARM® Cortex®-M4
Peripherals DMA, I2S, LVD, POR, PWM, WDT
Clock Frequency 32MHz
Program Memory TypeFLASH
Core Size 32-Bit
Program Memory Size 512KB 512K x 8
Connectivity CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
Supply Current-Max 77mA
Bit Size 32
Data Converter A/D 46x16b; D/A 2x12b
Has ADC YES
DMA Channels YES
PWM Channels YES
DAC Channels YES
ROM (words) 524288
CPU Family CORTEX-M4
Length 13mm
Height Seated (Max) 1.7mm
Width 13mm
RoHS StatusROHS3 Compliant
In-Stock:445 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$12.18000$12.18
10$11.29200$112.92
25$10.87840$271.96
160$9.73838$1558.1408
640$8.80600$5635.84

MK10DN512VMD10 Product Details

MK10DN512VMD10 Description


The MK10DN512VMD10 is a Kinetis? K10-100 MHz, Mixed-Signal Integration Microcontrollers (MCUs) based on Arm? Cortex?-M4 Core. There are numerous memory and integration options for these general-purpose MCUs. FlexMemory Its flexible, low-power, energy-efficient features assist embedded designers in resolving many of their most pressing problems. The flash memory capacity of devices ranges from 32 KB in a 5x5 mm 32 QFN package with a compact footprint to 1 MB in a 144 MAPBGA package with a variety of optional peripherals, including analog, communication, timing, and control.

A wide range of software and development tools are available to complement the Kinetis MCU family.



MK10DN512VMD10 Features


  • Security and integrity modules

– Hardware CRC module to support fast cyclic redundancy checks

– 128-bit unique identification (ID) number per chip

  • Human-machine interface

– Low-power hardware touch sensor interface (TSI)

– General-purpose input/output

  • Analog modules

– Two 16-bit SAR ADCs

– Programmable gain amplifier (PGA) (up to x64) integrated into each ADC

– Two 12-bit DACs

– Two transimpedance amplifiers

– Three analog comparators (CMP) containing a 6-bit DAC and programmable reference input

– Voltage reference

  • Timers

– Programmable delay block

– Eight-channel motor control/general purpose/PWM timer

– Two 2-channel quadrature decoder/general purpose timers

– Periodic interrupt timers

– 16-bit low-power timer

– Carrier modulator transmitter

– Real-time clock

  • Communication interfaces

– Two Controller Area Network (CAN) modules

– Three SPI modules

– Two I2C modules

– Six UART modules

– Secure Digital host controller (SDHC)

– I2S module

  • Operating Characteristics

– Voltage range: 1.71 to 3.6 V

– Flash write voltage range: 1.71 to 3.6 V

– Temperature range (ambient): -40 to 105°C

  • Performance

– Up to 100 MHz ARM Cortex-M4 core with DSP instructions delivering 1.25 Dhrystone MIPS per MHz

  • Memories and memory interfaces

– Up to 512 KB program flash memory on nonFlexMemory devices

– Up to 256 KB program flash memory on FlexMemory devices

– Up to 256 KB FlexNVM on FlexMemory devices

– 4 KB FlexRAM on FlexMemory devices

– Up to 128 KB RAM

– Serial programming interface (EzPort)

– FlexBus external bus interface

  • Clocks

– 3 to 32 MHz crystal oscillator

– 32 kHz crystal oscillator

– Multi-purpose clock generator

  • System peripherals

– Multiple low-power modes to provide power optimization based on application requirements

– Memory protection unit with multi-master protection

– 16-channel DMA controller, supporting up to 63 request sources

– External watchdog monitor

– Software watchdog

– Low-leakage wakeup unit



MK10DN512VMD10 Applications


  • Light sensing & controlling devices

  • Temperature sensing and controlling devices

  • Fire detection & safety devices

  • Industrial instrumentation devices

  • Process control devices


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