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MC860DECZQ50D4R2

MC860DECZQ50D4R2

MC860DECZQ50D4R2

NXP USA Inc.

Microprocessor MPC8xx Series MC860 357-BBGA

SOT-23

MC860DECZQ50D4R2 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 26 Weeks
Package / Case 357-BBGA
Operating Temperature-40°C~95°C TA
PackagingTape & Reel (TR)
Series MPC8xx
Published 2004
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number MC860
Speed 50MHz
Voltage - I/O 3.3V
Ethernet 10Mbps (2)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics AccelerationNo
RAM Controllers DRAM
Additional Interfaces I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Co-Processors/DSP Communications; CPM
RoHS StatusNon-RoHS Compliant
In-Stock:4354 items

MC860DECZQ50D4R2 Product Details

MC860DECZQ50D4R2 Overview


Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 357-BBGA. High reliability is achieved using advanced packaging method Tape & Reel (TR). 1 Core 32-Bit cores/Bus width are present in the CPU. Identify the operating temperature around -40°C~95°C TA. In the MPC8xx series, it is found. A total of DRAM RAM controllers are used by this CPU. The microprocessor features interfaces I2C, IrDA, PCMCIA, SPI, TDM, UART/USART for better service. At 3.3V, the CPU runs its I/O. Search MC860 for variants of the embedded microprocessor.

MC860DECZQ50D4R2 Features




MC860DECZQ50D4R2 Applications


There are a lot of NXP USA Inc.
MC860DECZQ50D4R2 Microprocessor applications.


  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
  • Microwave ovens
  • Home appliances
  • Home video and audio

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