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MC850DECZQ50BUR2

MC850DECZQ50BUR2

MC850DECZQ50BUR2

NXP USA Inc.

Microprocessor MPC8xx Series MC850 256-BBGA

SOT-23

MC850DECZQ50BUR2 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Package / Case 256-BBGA
Operating Temperature-40°C~95°C TA
PackagingTape & Reel (TR)
Series MPC8xx
Published 2004
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number MC850
Speed 50MHz
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics AccelerationNo
RAM Controllers SDRAM
USB USB 1.x (1)
Additional Interfaces HDLC, I2C, IrDA, PCMCIA, SCC, SDLC, SMC, SPI, UART
RoHS StatusNon-RoHS Compliant
In-Stock:2679 items

MC850DECZQ50BUR2 Product Details

MC850DECZQ50BUR2 Overview


The embedded microprocessor ships overseas conveniently packed in 256-BBGA. A high level of reliability is provided by using an advanced packaging method Tape & Reel (TR). In the CPU, there are 1 Core 32-Bit cores and 1 Core 32-Bit bus width. It is important to understand the operating temperature around -40°C~95°C TA. MPC8xx is its series number. It has SDRAM RAM controllers. A HDLC, I2C, IrDA, PCMCIA, SCC, SDLC, SMC, SPI, UART interface has been added to this microprocessor in order to serve the user better. As far as I/O is concerned, this CPU runs at 3.3V. To find variants of the microprocessor, try searching with MC850.

MC850DECZQ50BUR2 Features




MC850DECZQ50BUR2 Applications


There are a lot of NXP USA Inc.
MC850DECZQ50BUR2 Microprocessor applications.


  • Toys
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  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine

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