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MC68MH360ZP25LR2

MC68MH360ZP25LR2

MC68MH360ZP25LR2

NXP USA Inc.

CPU32+ Microprocessor M683xx Series MC68MH360 357-BGA

SOT-23

MC68MH360ZP25LR2 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Package / Case 357-BGA
Supplier Device Package 357-PBGA (25x25)
Operating Temperature0°C~70°C TA
PackagingTape & Reel (TR)
Series M683xx
Published 1997
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number MC68MH360
Speed 25MHz
Core Processor CPU32+
Voltage - I/O 5.0V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics AccelerationNo
RAM Controllers DRAM
Additional Interfaces SCC, SMC, SPI
Co-Processors/DSP Communications; CPM
RoHS StatusNon-RoHS Compliant
In-Stock:3938 items

MC68MH360ZP25LR2 Product Details

MC68MH360ZP25LR2 Overview


The embedded microprocessor has been packed in 357-BGA for convenient overseas shipping. Using advanced packaging techniques Tape & Reel (TR), high reliability is ensured. A CPU with 1 Core 32-Bit cores and width 1 Core 32-Bit busses is used. Understand how the operating temperature around 0°C~70°C TA is determined. This is a member of the M683xx series. With a core count of CPU32+, this CPU is multicore. A CPU with this architecture uses DRAM RAM controllers. With its SCC, SMC, SPI interfaces, this microprocessor will be able to serve you better. The CPU runs at 5.0V when it comes to I/O. Use MC68MH360 when searching for variants of the embedded microprocessor. Suppliers are offering 357-PBGA (25x25) packages.

MC68MH360ZP25LR2 Features


CPU32+ Core


MC68MH360ZP25LR2 Applications


There are a lot of NXP USA Inc.
MC68MH360ZP25LR2 Microprocessor applications.


  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
  • Microwave ovens
  • Home appliances
  • Home video and audio
  • Entertainment products

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