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MC68MH360VR33LR2

MC68MH360VR33LR2

MC68MH360VR33LR2

NXP USA Inc.

CPU32+ Microprocessor M683xx Series MC68MH360 357-BBGA

SOT-23

MC68MH360VR33LR2 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Package / Case 357-BBGA
Supplier Device Package 357-PBGA (25x25)
Operating Temperature0°C~70°C TA
PackagingTape & Reel (TR)
Series M683xx
Published 1995
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number MC68MH360
Speed 33MHz
Core Processor CPU32+
Voltage - I/O 5.0V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics AccelerationNo
RAM Controllers DRAM
Additional Interfaces SCC, SMC, SPI
Co-Processors/DSP Communications; CPM
RoHS StatusROHS3 Compliant
In-Stock:4210 items

MC68MH360VR33LR2 Product Details

MC68MH360VR33LR2 Overview


Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 357-BBGA. High reliability is achieved using advanced packaging method Tape & Reel (TR). 1 Core 32-Bit cores/Bus width are present in the CPU. Identify the operating temperature around 0°C~70°C TA. In the M683xx series, it is found. The CPU is cored by a processor with a number of 0 cores. A total of DRAM RAM controllers are used by this CPU. The microprocessor features interfaces SCC, SMC, SPI for better service. At 5.0V, the CPU runs its I/O. Search MC68MH360 for variants of the embedded microprocessor. It is offered by suppliers as a package 357-PBGA (25x25).

MC68MH360VR33LR2 Features


CPU32+ Core


MC68MH360VR33LR2 Applications


There are a lot of NXP USA Inc.
MC68MH360VR33LR2 Microprocessor applications.


  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
  • Microwave ovens
  • Home appliances
  • Home video and audio

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