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MC68MH360CZQ25L

MC68MH360CZQ25L

MC68MH360CZQ25L

NXP USA Inc.

CPU32+ Microprocessor M683xx Series MC68MH360 357-BBGA

SOT-23

MC68MH360CZQ25L Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Package / Case 357-BBGA
Supplier Device Package 357-PBGA (25x25)
Operating Temperature-40°C~85°C TA
PackagingTray
Series M683xx
Published 1997
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number MC68MH360
Speed 25MHz
Core Processor CPU32+
Voltage - I/O 5.0V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics AccelerationNo
RAM Controllers DRAM
Additional Interfaces SCC, SMC, SPI
Co-Processors/DSP Communications; CPM
RoHS StatusROHS3 Compliant
In-Stock:4695 items

MC68MH360CZQ25L Product Details

MC68MH360CZQ25L Overview


The microprocessor is conveniently packaged in 357-BBGA, making it easy to ship internationally. High reliability is provided by the advanced packaging method Tray. There are 1 Core 32-Bit cores/bus width on the CPU. Understand the operating temperature around -40°C~85°C TA. The M683xx series contains it. A CPU32+ processor powers this CPU. DRAM RAM controllers are used by this CPU. This microprocessor has SCC, SMC, SPI interfaces to serve you better. I/O is run at 5.0V on this CPU. Try searching for variants of the cpu microprocessor with MC68MH360. Suppliers offer a 357-PBGA (25x25) package.

MC68MH360CZQ25L Features


CPU32+ Core


MC68MH360CZQ25L Applications


There are a lot of NXP USA Inc.
MC68MH360CZQ25L Microprocessor applications.


  • Automatic control
  • Equipment control
  • Instrument control
  • Consumer electronics products
  • Toys
  • Robots
  • Radio
  • Television
  • Heater/Fan
  • Calculator

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