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MC68302RC25C

MC68302RC25C

MC68302RC25C

NXP USA Inc.

M68000 Microprocessor M683xx Series MC68302 132-BPGA Exposed Pad

SOT-23

MC68302RC25C Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Package / Case 132-BPGA Exposed Pad
Operating Temperature0°C~70°C TA
PackagingTray
Series M683xx
Published 1996
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number MC68302
Speed 25MHz
Core Processor M68000
Voltage - I/O 5.0V
Number of Cores/Bus Width 1 Core 8/16-Bit
Graphics AccelerationNo
RAM Controllers DRAM
Additional Interfaces GCI, IDL, ISDN, NMSI, PCM, SCPI
Co-Processors/DSP Communications; RISC CPM
RoHS StatusROHS3 Compliant
In-Stock:2196 items

MC68302RC25C Product Details

MC68302RC25C Overview


Shipping overseas is convenient since the embedded microprocessor is packed in 132-BPGA Exposed Pad. In order to provide high reliability, advanced packaging method Tray is used. Cores/Bus width is 1 Core 8/16-Bit. Recognize operating temperatures around 0°C~70°C TA. The cpu microprocessor belongs to the M683xx series. The CPU is cored with a M68000 processor. The CPU uses DRAM RAM controllers. This microprocessor features interfaces GCI, IDL, ISDN, NMSI, PCM, SCPI. In this CPU, I/O is set to 5.0V. The microprocessor can be searched for with MC68302 if you are looking for variants.

MC68302RC25C Features


M68000 Core


MC68302RC25C Applications


There are a lot of NXP USA Inc.
MC68302RC25C Microprocessor applications.


  • Consumer electronics products
  • Toys
  • Robots
  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers

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