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MC33PF8200DHESR2

MC33PF8200DHESR2

MC33PF8200DHESR2

NXP USA Inc.

2.5V~5.5V Specialized Power Management ICs

SOT-23

MC33PF8200DHESR2 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 2 Weeks
Mounting Type Surface Mount, Wettable Flank
Package / Case 56-VFQFN Exposed Pad
Operating Temperature-40°C~105°C TA
PackagingTape & Reel (TR)
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications High Performance i.MX 8, S32x Processor Based
Voltage - Supply 2.5V~5.5V
Analog IC - Other Type POWER SUPPLY MANAGEMENT CIRCUIT
In-Stock:490 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$13.80000$13.8
500$13.662$6831
1000$13.524$13524
1500$13.386$20079
2000$13.248$26496
2500$13.11$32775

MC33PF8200DHESR2 Product Details

MC33PF8200DHESR2 Overview


Tape & Reel (TR) is acceptable for shipping the power management.A convenient packaging is provided in the form of 56-VFQFN Exposed Pad .For easy adaptation, Surface Mount, Wettable Flank is a universal mounting method.It targets applications such as High Performance i.MX 8, S32x Processor Based and others.Ideally, the operating temperature of the power management ic should be set to -40°C~105°C TA to avoid any malfunctions.The power management runs on 2.5V~5.5V voltage.It has received high praise as a POWER SUPPLY MANAGEMENT CIRCUIT analog IC.

MC33PF8200DHESR2 Features


Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA
POWER SUPPLY MANAGEMENT CIRCUIT analog IC

MC33PF8200DHESR2 Applications


There are a lot of NXP USA Inc. MC33PF8200DHESR2Power Management applications.

  • Applications Processors
  • SmartPhones
  • WOA
  • Automotive Infotainment
  • Automotive camera module
  • Office Electronics
  • Laser TV
  • Computing
  • Projection Mapping
  • Automotive Infotainment

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