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MC33FS6512NAE

MC33FS6512NAE

MC33FS6512NAE

NXP USA Inc.

1V~5V Specialized Power Management ICs

SOT-23

MC33FS6512NAE Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 16 Weeks
Mounting Type Surface Mount
Package / Case 48-LQFP Exposed Pad
Operating Temperature-40°C~125°C
PackagingTray
Published 2017
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications System Basis Chip
Voltage - Supply 1V~5V
Peak Reflow Temperature (Cel) 260
[email protected] Reflow Temperature-Max (s) 40
Telecom IC Type INTERFACE CIRCUIT
RoHS StatusROHS3 Compliant
In-Stock:790 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$7.841000$7.841
10$7.397170$73.9717
100$6.978462$697.8462
500$6.583455$3291.7275
1000$6.210806$6210.806

MC33FS6512NAE Product Details

MC33FS6512NAE Overview


Using Tray as a shipping the power management path is acceptable.In order to facilitate transportation, it is packaged the power management in 48-LQFP Exposed Pad .The Surface Mount mounting method is universal for easy adaptation.It targets applications such as System Basis Chip and others.Keeping the operating temperature of the power management ic -40°C~125°C will prevent malfunctions.For its operation, this power management requires 1V~5V voltage.

MC33FS6512NAE Features


Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C

MC33FS6512NAE Applications


There are a lot of NXP USA Inc. MC33FS6512NAEPower Management applications.

  • Portable Navigation Devices
  • DDR2 Termination Voltage
  • Networking Equipment
  • Peripheral I/O Power
  • Automotive Digital Cluster
  • FPGA
  • Digital Signage
  • Tablets
  • LTE modem
  • Motherboard

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