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MC33FS6510NAER2

MC33FS6510NAER2

MC33FS6510NAER2

NXP USA Inc.

1V~5V Specialized Power Management ICs

SOT-23

MC33FS6510NAER2 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 17 Weeks
Mounting Type Surface Mount
Package / Case 48-LQFP Exposed Pad
Operating Temperature-40°C~125°C
PackagingTape & Reel (TR)
Published 2017
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications System Basis Chip
Voltage - Supply 1V~5V
Peak Reflow Temperature (Cel) 260
[email protected] Reflow Temperature-Max (s) 40
Telecom IC Type INTERFACE CIRCUIT
RoHS StatusROHS3 Compliant
In-Stock:1071 items

Pricing & Ordering

QuantityUnit PriceExt. Price

MC33FS6510NAER2 Product Details

MC33FS6510NAER2 Overview


Tape & Reel (TR) is acceptable for shipping the power management.A convenient packaging is provided in the form of 48-LQFP Exposed Pad .For easy adaptability, Surface Mount provides a universal mounting method.The power management is targeted at System Basis Chip and other applications.Ideally, the operating temperature of the power management ic should be set at -40°C~125°C in order to prevent malfunction.The power management runs on 1V~5V voltage.

MC33FS6510NAER2 Features


Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C

MC33FS6510NAER2 Applications


There are a lot of NXP USA Inc. MC33FS6510NAER2Power Management applications.

  • Printers
  • Field Service
  • WOA
  • Radar system ECU
  • LP2996A: DDR3L
  • Real-time Signal Monitoring
  • Docking station
  • Power Supplies
  • Portable Navigation Devices
  • System Thermal for PCs

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