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MC33FS6503NAER2

MC33FS6503NAER2

MC33FS6503NAER2

NXP USA Inc.

1V~5V Specialized Power Management ICs

SOT-23

MC33FS6503NAER2 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 17 Weeks
Mounting Type Surface Mount
Package / Case 48-LQFP Exposed Pad
Operating Temperature-40°C~125°C
PackagingTape & Reel (TR)
Published 2017
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications System Basis Chip
Voltage - Supply 1V~5V
Peak Reflow Temperature (Cel) 260
[email protected] Reflow Temperature-Max (s) 40
Telecom IC Type INTERFACE CIRCUIT
RoHS StatusROHS3 Compliant
In-Stock:818 items

Pricing & Ordering

QuantityUnit PriceExt. Price

MC33FS6503NAER2 Product Details

MC33FS6503NAER2 Overview


It is acceptable to ship in the direction of Tape & Reel (TR) .packaged the power management in 48-LQFP Exposed Pad for ease of transportation, it is easy to transport.For ease of adaptability, Surface Mount is an universal mounting method.The power management is intended for use at System Basis Chip as well as other applications.It is recommended that the operating temperature of the power management ic be set to -40°C~125°C in order to prevent malfunction.The power management operates at 1V~5V volts.

MC33FS6503NAER2 Features


Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C

MC33FS6503NAER2 Applications


There are a lot of NXP USA Inc. MC33FS6503NAER2Power Management applications.

  • Computing
  • Automotive Digital Cluster
  • Cluster
  • Automotive Infotainment
  • Port/cable adapters
  • System Health Monitoring
  • LP2996A: DDR3
  • Networking Equipment
  • Industrial PC
  • Hearing Aids

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