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MC33FS6502LAE

MC33FS6502LAE

MC33FS6502LAE

NXP USA Inc.

1V~5V Specialized Power Management ICs

SOT-23

MC33FS6502LAE Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 17 Weeks
Mounting Type Surface Mount
Package / Case 48-LQFP Exposed Pad
Operating Temperature-40°C~125°C
PackagingTray
Published 2017
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications System Basis Chip
Voltage - Supply 1V~5V
Peak Reflow Temperature (Cel) 260
[email protected] Reflow Temperature-Max (s) 40
Telecom IC Type INTERFACE CIRCUIT
RoHS StatusROHS3 Compliant
In-Stock:845 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$8.43000$8.43
10$7.61100$76.11
25$7.25720$181.43
250$6.01800$1504.5
500$5.48700$2743.5

MC33FS6502LAE Product Details

MC33FS6502LAE Overview


It is acceptable to ship in the direction of Tray .It is packaged the power management in 48-LQFP Exposed Pad for ease of transportation.Surface Mount is a universal mounting method for easy adaptation.This power management targets at System Basis Chip and other applications.Keeping the operating temperature of the power management ic -40°C~125°C will prevent malfunctions.As a result, this power management is powered by 1V~5V voltage.

MC33FS6502LAE Features


Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C

MC33FS6502LAE Applications


There are a lot of NXP USA Inc. MC33FS6502LAEPower Management applications.

  • Wireless routers
  • Storage Systems
  • SSTL-18 Termination
  • LP2996A: DDR3
  • Termination Voltage
  • Desktop PC
  • DDR-II Termination Voltage
  • Power Supplies
  • Chromebook
  • Medical

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