MC33FS6501CAER2 Overview
It is acceptable to ship using the method Tape & Reel (TR) .It is packaged the power management in 48-LQFP Exposed Pad for ease of transportation.The Surface Mount mounting method facilitates easy adaptation.There are a number of applications targeted at System Basis Chip .It is recommended that the operating temperature of the power management ic be set to -40°C~125°C to prevent malfunctions.For its operation, this power management requires 1V~5V voltage.
MC33FS6501CAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6501CAER2 Applications
There are a lot of NXP USA Inc. MC33FS6501CAER2Power Management applications.
- Modules With Remote-Sense Capability
- Chromebook
- Port/cable dongles
- Debug
- System Thermal for PCs
- LP2996A: DDR2
- Standard notebook PC
- Real-time Signal Monitoring
- Netbooks
- Storage Systems
