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MC33FS4500LAER2

MC33FS4500LAER2

MC33FS4500LAER2

NXP USA Inc.

1V~5V Specialized Power Management ICs

SOT-23

MC33FS4500LAER2 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 17 Weeks
Mounting Type Surface Mount
Package / Case 48-LQFP Exposed Pad
Operating Temperature-40°C~125°C
PackagingTape & Reel (TR)
Published 2017
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications System Basis Chip
Voltage - Supply 1V~5V
Peak Reflow Temperature (Cel) 260
[email protected] Reflow Temperature-Max (s) 40
Telecom IC Type INTERFACE CIRCUIT
RoHS StatusROHS3 Compliant
In-Stock:1081 items

Pricing & Ordering

QuantityUnit PriceExt. Price

MC33FS4500LAER2 Product Details

MC33FS4500LAER2 Overview


Shipments can be made in the direction of Tape & Reel (TR) .For ease of transportation, it is packaged the power management in 48-LQFP Exposed Pad .Surface Mount is an universal mounting way for easy adapting.There are a number of applications targeted at System Basis Chip .It is recommended that the operating temperature of the power management ic be set to -40°C~125°C in order to prevent malfunction.The power management runs on 1V~5V voltage.

MC33FS4500LAER2 Features


Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C

MC33FS4500LAER2 Applications


There are a lot of NXP USA Inc. MC33FS4500LAER2Power Management applications.

  • SSTL-2 Termination
  • Docking station
  • Automotive Infotainment
  • Industrial/ATE
  • Automotive head unit
  • Tablet PCs
  • Telecom Rectifiers
  • HSTL Termination
  • Radar system ECU
  • Termination Voltage

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