LS1023ASE8MNLB Overview
Shipping overseas is convenient since the embedded microprocessor is packed in 780-FBGA, FCBGA. In order to provide high reliability, advanced packaging method Tray is used. Cores/Bus width is 2 Core 64-Bit. Recognize operating temperatures around 0°C~105°C. The cpu microprocessor belongs to the QorIQ® Layerscape series. The CPU is cored with a ARM® Cortex®-A53 processor. The CPU uses DDR3L, DDR4 RAM controllers.
LS1023ASE8MNLB Features
ARM® Cortex®-A53 Core
LS1023ASE8MNLB Applications
There are a lot of NXP USA Inc.
LS1023ASE8MNLB Microprocessor applications.
- Consumer electronics products
- Toys
- Robots
- Radio
- Television
- Heater/Fan
- Calculator
- Kindle
- Christmas lights
- 3D printers
