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LS1022AXE7EKB

LS1022AXE7EKB

LS1022AXE7EKB

NXP USA Inc.

ARM® Cortex®-A7 Microprocessor QorIQ® Layerscape Series 525-FBGA, FCBGA

SOT-23

LS1022AXE7EKB Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 18 Weeks
Package / Case 525-FBGA, FCBGA
Operating Temperature-40°C~105°C
PackagingTray
Series QorIQ® Layerscape
Published 2002
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Speed 600MHz
Core Processor ARM® Cortex®-A7
Ethernet GbE (2)
Number of Cores/Bus Width 2 Core 32-Bit
RAM Controllers DDR3L, DDR4
USB USB 2.0 (1)
Co-Processors/DSP Multimedia; NEON™ SIMD
Security FeaturesSecure Boot, TrustZone®
SATA SATA 3Gbps (1)
RoHS StatusROHS3 Compliant
In-Stock:170 items

Pricing & Ordering

QuantityUnit PriceExt. Price
84$32.09595$2696.0598

LS1022AXE7EKB Product Details

LS1022AXE7EKB Overview


The embedded microprocessor ships overseas conveniently packed in 525-FBGA, FCBGA. A high level of reliability is provided by using an advanced packaging method Tray. In the CPU, there are 2 Core 32-Bit cores and 2 Core 32-Bit bus width. It is important to understand the operating temperature around -40°C~105°C. QorIQ® Layerscape is its series number. Core-wise, this CPU has a ARM® Cortex®-A7 processor. It has DDR3L, DDR4 RAM controllers.

LS1022AXE7EKB Features


ARM® Cortex®-A7 Core


LS1022AXE7EKB Applications


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LS1022AXE7EKB Microprocessor applications.


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