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LPC55S26JBD64K

LPC55S26JBD64K

LPC55S26JBD64K

NXP USA Inc.

256KB 256K x 8 FLASH ARM® Cortex®-M33 32-Bit Microcontroller LPC55S2x Series 64-TQFP Exposed Pad

SOT-23

LPC55S26JBD64K Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 16 Weeks
Mounting Type Surface Mount
Package / Case 64-TQFP Exposed Pad
Operating Temperature-40°C~105°C TA
Series LPC55S2x
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Oscillator TypeInternal
Number of I/O 36
Speed 150MHz
RAM Size 144K x 8
Voltage - Supply (Vcc/Vdd) 1.8V~3.6V
Core Processor ARM® Cortex®-M33
Peripherals Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Program Memory TypeFLASH
Core Size 32-Bit
Program Memory Size 256KB 256K x 8
Connectivity Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Data Converter A/D 10x16b
RoHS StatusROHS3 Compliant
In-Stock:746 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$8.41000$8.41
500$8.3259$4162.95
1000$8.2418$8241.8
1500$8.1577$12236.55
2000$8.0736$16147.2
2500$7.9895$19973.75

LPC55S26JBD64K Product Details

LPC55S26JBD64K Overview


The package has a 64-TQFP Exposed Pad shape. With 36 I/Os, it's pretty good. The Microcontroller's mounting type is Surface Mount and this IC chip has the following features. As the name implies, this Microcontroller is based on the 32-Bit core. As far as its program memory type is concerned, it is FLASH. Temperatures within -40°C~105°C TA range are measured by this Microcontroller. The LPC55S2x series is comprised of this electrical component. The electronic part has a program memory size of 256KB 256K x 8. There's a ARM® Cortex®-M33 Core Processor inside.

LPC55S26JBD64K Features


64-TQFP Exposed Pad package
Mounting type of Surface Mount


LPC55S26JBD64K Applications


There are a lot of NXP USA Inc.
LPC55S26JBD64K Microcontroller applications.


  • Robots
  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
  • Microwave ovens

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