LPC2364FET100,518 Overview
The package is 100-TFBGA-shaped. There are 70 I/Os. In the case of the IC chip, the type of mounting is Surface Mount. Microcontroller is based on the 16/32-Bit core architecture. The type of program memory it uses is FLASH. Temperatures in the range of -40°C~85°C TA are operated by this Microcontroller. It is part of the LPC2300 series of electrical components. Having a size of 128KB 128K x 8, Microcontroller has a program memory of X bytes. A ARM7® Core Processor is at the core of this Microcontroller. This device belongs to the MICROCONTROLLER, RISC uPs/uCs/Peripheral ICs category. IC Chip 100 has 100 terminations. 32-bits are used for its size. IC Chip has 3.3V volt supply outputs. With YES DMA channels, Microcontroller chip can handle large data transfers. Using the base part number LPC2364, you will be able to find alternatives for the part. Devices work in YES PWM channels. The pin count is 100. As far as its frequency goes, it operates according to a 25MHz clock.
LPC2364FET100,518 Features
100-TFBGA package
Mounting type of Surface Mount
LPC2364FET100,518 Applications
There are a lot of NXP USA Inc.
LPC2364FET100,518 Microcontroller applications.
- Instrument control
- Toys
- Robots
- Radio
- Television
- Heater/Fan
- Calculator
- Kindle
- Christmas lights
- 3D printers
