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LPC18S10FET180E

LPC18S10FET180E

LPC18S10FET180E

NXP USA Inc.

ROMless ARM® Cortex®-M3 32-Bit Microcontroller LPC18xx Series 180-TFBGA

SOT-23

LPC18S10FET180E Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 180-TFBGA
Operating Temperature-40°C~85°C TA
PackagingTray
Series LPC18xx
Published 2014
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Oscillator TypeInternal
Number of I/O 49
Speed 180MHz
RAM Size 136K x 8
Voltage - Supply (Vcc/Vdd) 2.2V~3.6V
Core Processor ARM® Cortex®-M3
Peripherals Brown-out Detect/Reset, DMA, I2S, POR, WDT
Program Memory TypeROMless
Core Size 32-Bit
Connectivity CANbus, EBI/EMI, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART
Data Converter A/D 4x10b; D/A 1x10b
RoHS StatusROHS3 Compliant
In-Stock:958 items

Pricing & Ordering

QuantityUnit PriceExt. Price
189$6.44894$1218.84966

LPC18S10FET180E Product Details

LPC18S10FET180E Overview


In a 180-TFBGA package, the MCU is available. 49 I/Os are available. The Microcontroller has a mounting type of Surface Mount, which indicates that it is mounted conveniently. The 32-Bit core is the core of the MCU. There is a ROMless type of memory for its program. There is a temperature range of -40°C~85°C TA that is operated by this Microcontroller. LPC18xx series components make up this electrical component. A ARM® Cortex®-M3 Core processor is used to power the device.

LPC18S10FET180E Features


180-TFBGA package
Mounting type of Surface Mount


LPC18S10FET180E Applications


There are a lot of NXP USA Inc.
LPC18S10FET180E Microcontroller applications.


  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
  • Microwave ovens
  • Home appliances
  • Home video and audio
  • Entertainment products

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