LPC18S10FET100E Overview
The package is 100-TFBGA-shaped. There are 49 I/Os. In the case of the IC chip, the type of mounting is Surface Mount. Microcontroller is based on the 32-Bit core architecture. The type of program memory it uses is ROMless. Temperatures in the range of -40°C~85°C TA are operated by this Microcontroller. It is part of the LPC18xx series of electrical components. A ARM® Cortex®-M3 Core Processor is at the core of this Microcontroller. This device belongs to the MICROCONTROLLER, RISC uPs/uCs/Peripheral ICs category. The pin count is 100.
LPC18S10FET100E Features
100-TFBGA package
Mounting type of Surface Mount
LPC18S10FET100E Applications
There are a lot of NXP USA Inc.
LPC18S10FET100E Microcontroller applications.
- Instrument control
- Toys
- Robots
- Radio
- Television
- Heater/Fan
- Calculator
- Kindle
- Christmas lights
- 3D printers
