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KMPC875CZT66

KMPC875CZT66

KMPC875CZT66

NXP USA Inc.

Microprocessor MPC8xx Series MPC875 256-BBGA

SOT-23

KMPC875CZT66 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Package / Case 256-BBGA
Operating Temperature-40°C~100°C TA
PackagingTray
Series MPC8xx
Published 2003
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number MPC875
Speed 66MHz
Voltage - I/O 3.3V
Ethernet 10Mbps (1), 10/100Mbps (2)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics AccelerationNo
RAM Controllers DRAM
USB USB 2.0 (1)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Co-Processors/DSP Communications; CPM, Security; SEC
Security FeaturesCryptography
RoHS StatusNon-RoHS Compliant
In-Stock:2125 items

KMPC875CZT66 Product Details

KMPC875CZT66 Overview


Shipping overseas is convenient since the embedded microprocessor is packed in 256-BBGA. In order to provide high reliability, advanced packaging method Tray is used. Cores/Bus width is 1 Core 32-Bit. Recognize operating temperatures around -40°C~100°C TA. The cpu microprocessor belongs to the MPC8xx series. The CPU uses DRAM RAM controllers. This microprocessor features interfaces HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART. In this CPU, I/O is set to 3.3V. The microprocessor can be searched for with MPC875 if you are looking for variants.

KMPC875CZT66 Features




KMPC875CZT66 Applications


There are a lot of NXP USA Inc.
KMPC875CZT66 Microprocessor applications.


  • Consumer electronics products
  • Toys
  • Robots
  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers

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