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KMPC8555PXALF

KMPC8555PXALF

KMPC8555PXALF

NXP USA Inc.

PowerPC e500 Microprocessor MPC85xx Series MPC8555 783-BBGA, FCBGA

SOT-23

KMPC8555PXALF Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Package / Case 783-BBGA, FCBGA
Supplier Device Package 783-FCPBGA (29x29)
Operating Temperature0°C~105°C TA
PackagingTray
Series MPC85xx
Published 2004
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number MPC8555
Speed 667MHz
Core Processor PowerPC e500
Voltage - I/O 2.5V 3.3V
Ethernet 10/100/1000Mbps (2)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics AccelerationNo
RAM Controllers DDR, SDRAM
USB USB 2.0 (1)
Additional Interfaces DUART, I2C, PCI, SPI, TDM, UART
Co-Processors/DSP Communications; CPM
RoHS StatusNon-RoHS Compliant
In-Stock:4535 items

KMPC8555PXALF Product Details

KMPC8555PXALF Overview


Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 783-BBGA, FCBGA. High reliability is achieved using advanced packaging method Tray. 1 Core 32-Bit cores/Bus width are present in the CPU. Identify the operating temperature around 0°C~105°C TA. In the MPC85xx series, it is found. The CPU is cored by a processor with a number of 0 cores. A total of DDR, SDRAM RAM controllers are used by this CPU. The microprocessor features interfaces DUART, I2C, PCI, SPI, TDM, UART for better service. At 2.5V 3.3V, the CPU runs its I/O. Search MPC8555 for variants of the embedded microprocessor. It is offered by suppliers as a package 783-FCPBGA (29x29).

KMPC8555PXALF Features


PowerPC e500 Core


KMPC8555PXALF Applications


There are a lot of NXP USA Inc.
KMPC8555PXALF Microprocessor applications.


  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
  • Microwave ovens
  • Home appliances
  • Home video and audio

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