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KMPC850DECVR66BU

KMPC850DECVR66BU

KMPC850DECVR66BU

NXP USA Inc.

Microprocessor MPC8xx Series MPC850 256-BBGA

SOT-23

KMPC850DECVR66BU Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Package / Case 256-BBGA
Operating Temperature-40°C~95°C TA
PackagingTray
Series MPC8xx
Published 2004
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number MPC850
Speed 66MHz
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics AccelerationNo
RAM Controllers DRAM
USB USB 1.x (1)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Co-Processors/DSP Communications; CPM
RoHS StatusROHS3 Compliant
In-Stock:1615 items

KMPC850DECVR66BU Product Details

KMPC850DECVR66BU Overview


The microprocessor is convenient for international shipping since it is packaged in 256-BBGA. The packaging method Tray provides high reliability. There are 1 Core 32-Bit cores per bus width on the CPU. The operating temperature around -40°C~95°C TA should be understood. This is part of the MPC8xx series. There are DRAM RAM controllers on this CPU. This microprocessor features HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART interfaces to better serve its users. The CPU runs I/O at 3.3V. Using MPC850 will help you find variants of the cpu microprocessor.

KMPC850DECVR66BU Features




KMPC850DECVR66BU Applications


There are a lot of NXP USA Inc.
KMPC850DECVR66BU Microprocessor applications.


  • Equipment control
  • Instrument control
  • Consumer electronics products
  • Toys
  • Robots
  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle

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