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982-037-020R121

982-037-020R121

982-037-020R121

NorComp Inc.

CONN BACKSHELL 37P 90/180DEG SHD

SOT-23

982-037-020R121 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 14 Weeks
Shell Material Thermoplastic
Material Plastic, Metallized
Published 2006
Series 982
Feature Mating Screws 4-40
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Positions 37
Color Silver
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Shielding Shielded
Approval Agency UL
Operating Temperature (Max) 140°C
Operating Temperature (Min) -55°C
Plating Nickel over Copper
Connector Support Type CONNECTOR ACCESSORY
Cable TypeRound
Accessory Type Two Piece Backshell
Wire/Cable Diameter 11.18 mm
Cable Exit 90°, 180°
Cable Entry-Max 0.444 inch
Hardware Assembly Hardware, Strain Relief
Height 46mm
Length 69.6mm
Width 16mm
RoHS StatusROHS3 Compliant
Flammability Rating UL94 V-0
Lead Free Lead Free
In-Stock:396 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$13.699712$13.699712
10$12.924257$129.24257
100$12.192695$1219.2695
500$11.502543$5751.2715
1000$10.851456$10851.456

About 982-037-020R121

The 982-037-020R121 from NorComp Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN BACKSHELL 37P 90/180DEG SHD.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 982-037-020R121, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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