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973-009-010R011

973-009-010R011

973-009-010R011

NorComp Inc.

CONN BACKSHELL 9POS 180DEG BLACK

SOT-23

973-009-010R011 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 14 Weeks
Package / Case 009
Shell Material Plastic
Material Acrylonitrile Butadiene Styrene (ABS)
Body Material ABS
Published 2005
Series 973
Feature Mating Screws 4-40
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Positions 9
Color Black
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Shielding Unshielded
Operating Temperature (Max) 125°C
Operating Temperature (Min) -55°C
Plating Copper
Connector Support Type CONNECTOR ACCESSORY
Cable TypeRound
Accessory Type Two Piece Backshell
Wire/Cable Diameter 8.51 mm
Cable Exit 180°
Hardware Assembly Hardware, Strain Relief
Height 15.2mm
Length 31.5mm
Width 31mm
REACH SVHC No SVHC
RoHS StatusROHS3 Compliant
Flammability Rating UL94 V-0
Lead Free Lead Free
In-Stock:1402 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$4.918556$4.918556
10$4.640147$46.40147
100$4.377497$437.7497
500$4.129715$2064.8575
1000$3.895958$3895.958

About 973-009-010R011

The 973-009-010R011 from NorComp Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN BACKSHELL 9POS 180DEG BLACK.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 973-009-010R011, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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