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74LVC3G07DP-Q100H

74LVC3G07DP-Q100H

74LVC3G07DP-Q100H

Nexperia USA Inc.

IC BUF NON-INVERT 5.5V 8TSSOP

SOT-23

74LVC3G07DP-Q100H Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Contact PlatingGold
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
Number of Pins 8
Operating Temperature-40°C~125°C TA
PackagingTape & Reel (TR)
Series Automotive, AEC-Q100, 74LVC
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
Technology CMOS
Voltage - Supply 1.65V~5.5V
Terminal Position DUAL
Terminal FormGULL WING
Number of Functions 3
Supply Voltage 3.3V
Terminal Pitch0.65mm
Base Part Number 74LVC3G07
Pin Count8
Output Type Open Drain
Polarity Non-Inverting
Supply Voltage-Max (Vsup) 5.5V
Propagation Delay8.4 ns
Quiescent Current40μA
Family LVC/LCX/Z
Logic Function Buffer
Number of Inputs 3
Current - Output High, Low - 32mA
Logic Type Buffer, Non-Inverting
Number of Bits per Element 1
Radiation HardeningNo
RoHS StatusROHS3 Compliant
In-Stock:30373 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About 74LVC3G07DP-Q100H

The 74LVC3G07DP-Q100H from Nexperia USA Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features IC BUF NON-INVERT 5.5V 8TSSOP.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 74LVC3G07DP-Q100H, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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