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GRM1UT556S1H330GZ01D

GRM1UT556S1H330GZ01D

GRM1UT556S1H330GZ01D

MURATAELECTRONICS

GRM1UT556S1H330GZ01D datasheet pdf and Boxes product details from MURATAELECTRONICS stock available on our website

SOT-23

GRM1UT556S1H330GZ01D Datasheet PDF

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Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time LAST SHIPMENTS (Last Updated: 4 days ago)
Lifecycle Status 21 Weeks
Mount -
Mounting Type Press Fit, Through Hole
Package / Case TO-206AB, TO-46-3 Metal Can
Number of Pins 6
Operating Temperature 0°C ~ 125°C
Packaging Tape & Reel (TR)
Pbfree Code yes
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 3
ECCN Code EAR99
Temperature Coefficient -
Subcategory Other Regulators
Voltage - Supply 4V ~ 30V
Base Part Number Wlfh Ioag
Output Voltage 38 V
Output Type P-Channel
Interface Analog
Termination Type SOLDER
Operating Supply Current 1 mA
Nominal Supply Current 800 μA
Output Current 80 mA
Max Supply Current 80 μA
Slew Rate 0.1V/μs
Architecture -
Amplifier Type -
In-Stock:4846 items

About GRM1UT556S1H330GZ01D

The GRM1UT556S1H330GZ01D from MURATAELECTRONICS is a high-performance microcontroller designed for a wide range of embedded applications. This component features GRM1UT556S1H330GZ01D datasheet pdf and Boxes product details from MURATAELECTRONICS stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the GRM1UT556S1H330GZ01D, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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