Welcome to Hotenda.com Online Store!

logo
userjoin
Home

RDER72A683K1K1C03B

RDER72A683K1K1C03B

RDER72A683K1K1C03B

Murata Electronics

Multilayer Ceramic Capacitors MLCC - Leaded 68000pF 10% 100Volts

SOT-23

RDER72A683K1K1C03B Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Lifecycle Status DISCONTINUED (Last Updated: 5 months ago)
Mount Through Hole
Mounting Type Through Hole
Package / Case Radial
Terminal Shape WIRE
Operating Temperature-55°C~125°C
PackagingBulk
Series RDE
Size / Dimension 0.177Lx0.124W 4.50mmx3.15mm
Tolerance ±10%
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Temperature CoefficientX7R
Composition Ceramic
Applications General Purpose
HTS Code8532.23.00.60
Capacitance 0.068μF
Voltage - Rated DC 100V
Lead Pitch 5mm
Lead Spacing0.197 5.00mm
Temperature Characteristics Code X7R
Multilayer No
Lead Diameter 500 μm
Size Code 1812
Lead Style Formed Leads
Lead/Base Style Flat
Height 3.5mm
Height Seated (Max) 0.197 5.00mm
Radiation HardeningNo
RoHS StatusROHS3 Compliant
In-Stock:1785 items

About RDER72A683K1K1C03B

The RDER72A683K1K1C03B from Murata Electronics is a high-performance microcontroller designed for a wide range of embedded applications. This component features Multilayer Ceramic Capacitors MLCC - Leaded 68000pF 10% 100Volts.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the RDER72A683K1K1C03B, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

Get Subscriber

Enter Your Email Address, Get the Latest News