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LQM2HPN3R3MGSL

LQM2HPN3R3MGSL

LQM2HPN3R3MGSL

Murata Electronics

FIXED IND 3.3UH 1.05A 210 MOHM

SOT-23

LQM2HPN3R3MGSL Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 7 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 1008 (2520 Metric)
Terminal Shape WRAPAROUND
Shape/Size Description RECTANGULAR PACKAGE
Core MaterialFERRITE
Operating Temperature-40°C~85°C
PackagingTape & Reel (TR)
Series LQM2
Size / Dimension 0.098Lx0.079W 2.50mmx2.00mm
Tolerance ±20%
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Type Multilayer
HTS Code8504.50.80.00
Packing Method TR, Embossed Plastic, 7 Inch
Shielding YES
Number of Functions 1
Current Rating1.05A
Inductance 3.3μH
Test Frequency1MHz
DC Resistance (DCR) 263mOhm Max
Frequency - Self Resonant 20MHz
Inductor Application RF INDUCTOR
Terminal Placement DUAL ENDED
Inductance Frequency - Test 1MHz
Height Seated (Max) 0.039 1.00mm
RoHS StatusROHS3 Compliant
In-Stock:82375 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About LQM2HPN3R3MGSL

The LQM2HPN3R3MGSL from Murata Electronics is a high-performance microcontroller designed for a wide range of embedded applications. This component features FIXED IND 3.3UH 1.05A 210 MOHM.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the LQM2HPN3R3MGSL, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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