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DEA1X3D270JC1B

DEA1X3D270JC1B

DEA1X3D270JC1B

Murata Electronics

CAP CER 27PF 2KV SL RADIAL

SOT-23

DEA1X3D270JC1B Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Lifecycle Status DISCONTINUED (Last Updated: 5 months ago)
Mount Through Hole
Mounting Type Through Hole
Package / Case Radial, Disc
Terminal Shape WIRE
Operating Temperature-25°C~125°C
PackagingBulk
Series DEA
Size / Dimension 0.177Dia 4.50mm
Tolerance ±5%
Feature High Voltage
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
Termination Radial
ECCN Code EAR99
Temperature CoefficientSL
Composition Ceramic
Applications General Purpose
HTS Code8532.23.00.60
Capacitance 27pF
Voltage - Rated DC 2kV
Depth 5mm
Lead Pitch 5mm
Lead Length 25mm
Lead Spacing0.197 5.00mm
Temperature Characteristics Code SL
Multilayer No
Rated (DC) Voltage (URdc) 2000V
Lead Diameter 500 μm
Size Code 1820
Lead Style Straight
Height Seated (Max) 0.295 7.50mm
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:5000 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.32000$0.32
10$0.22200$2.22
100$0.13320$13.32
500$0.09990$49.95

About DEA1X3D270JC1B

The DEA1X3D270JC1B from Murata Electronics is a high-performance microcontroller designed for a wide range of embedded applications. This component features CAP CER 27PF 2KV SL RADIAL.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the DEA1X3D270JC1B, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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