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XPC860TZP80D3

XPC860TZP80D3

XPC860TZP80D3

MOTOROLA INC

XPC860TZP80D3 datasheet pdf and Unclassified product details from MOTOROLA INC stock available on our website

SOT-23

XPC860TZP80D3 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Surface MountYES
Number of Terminals 357
JESD-609 Code e0
ECCN Code 3A991.A.2
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code8542.31.00.01
Subcategory Other Microprocessor ICs
Technology CMOS
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 3.3V
Terminal Pitch1.27mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B357
Qualification StatusNot Qualified
Supply Voltage-Max (Vsup) 3.465V
Power Supplies3.3V
Supply Voltage-Min (Vsup) 3.135V
Speed 80 MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Clock Frequency 40MHz
Bit Size 32
Seated Height-Max 2.05mm
Address Bus Width32
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
Length 25mm
Width 25mm
RoHS StatusNon-RoHS Compliant
In-Stock:1532 items

About XPC860TZP80D3

The XPC860TZP80D3 from MOTOROLA INC is a high-performance microcontroller designed for a wide range of embedded applications. This component features XPC860TZP80D3 datasheet pdf and Unclassified product details from MOTOROLA INC stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the XPC860TZP80D3, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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