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8837-0-15-01-14-27-10-0

8837-0-15-01-14-27-10-0

8837-0-15-01-14-27-10-0

Mill-Max Manufacturing Corp.

CONN PIN RCPT .065-.082 SOLDER

SOT-23

8837-0-15-01-14-27-10-0 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 5 Weeks
Contact MaterialBeryllium Copper
Mount Through Hole
Mounting Hole Diameter 0.159 (4.04mm)
Operating Temperature-55°C~125°C
PackagingBulk
Published 2012
Series 8837
Pbfree Code no
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
HTS Code8536.90.40.00
Contact Finish Gold
Terminal and Terminal Block Type PCB TERMINAL
Hole Diameter 4.0386 mm
Flange Diameter0.187 (4.75mm)
Tail Type No Tail
Accepts Pin Diameter 0.065 ~ 0.082 (1.65mm ~ 2.08mm)
Socket Depth 0.250 6.35mm
Pin Hole Diameter0.107 (2.72mm)
Length 7.7724mm
Contact Finish Thickness 30.0μin 0.76μm
Length - Overall 0.306 7.77mm
RoHS StatusNon-RoHS Compliant
In-Stock:8682 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.775298$0.775298
10$0.731414$7.31414
100$0.690013$69.0013
500$0.650955$325.4775
1000$0.614109$614.109

About 8837-0-15-01-14-27-10-0

The 8837-0-15-01-14-27-10-0 from Mill-Max Manufacturing Corp. is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN PIN RCPT .065-.082 SOLDER.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 8837-0-15-01-14-27-10-0, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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