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8331-0-15-80-18-27-10-0

8331-0-15-80-18-27-10-0

8331-0-15-80-18-27-10-0

Mill-Max Manufacturing Corp.

Circuit Board Hardware - PCB 200u SN OVER NI 18 CON

SOT-23

8331-0-15-80-18-27-10-0 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 5 Weeks
Contact MaterialBeryllium Copper
Mounting Hole Diameter 0.071 (1.80mm)
Operating Temperature-55°C~125°C
PackagingBulk
Published 2013
Series 8331
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Termination Solder
ECCN Code EAR99
HTS Code8536.90.40.00
Contact Finish Gold
Terminal and Terminal Block Type PCB TERMINAL
Flange Diameter0.078 (1.98mm)
Tail Type No Tail
Accepts Pin Diameter 0.037 ~ 0.043 (0.94mm ~ 1.09mm)
Socket Depth 0.127 3.23mm
Pin Hole Diameter0.054 (1.37mm)
Contact Finish Thickness 30.0μin 0.76μm
Length - Overall 0.150 3.81mm
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:4507 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$1.369906$1.369906
10$1.292364$12.92364
100$1.219211$121.9211
500$1.150199$575.0995
1000$1.085094$1085.094

About 8331-0-15-80-18-27-10-0

The 8331-0-15-80-18-27-10-0 from Mill-Max Manufacturing Corp. is a high-performance microcontroller designed for a wide range of embedded applications. This component features Circuit Board Hardware - PCB 200u SN OVER NI 18 CON.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 8331-0-15-80-18-27-10-0, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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