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4040-0-19-15-07-27-10-0

4040-0-19-15-07-27-10-0

4040-0-19-15-07-27-10-0

Mill-Max Manufacturing Corp.

Circuit Board Hardware - PCB 10u AU OVER NI 07 CON

SOT-23

4040-0-19-15-07-27-10-0 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 5 Weeks
Contact MaterialBeryllium Copper
Operating Temperature-55°C~125°C
PackagingBulk
Published 2016
Series 4040
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
HTS Code8536.90.40.00
Contact Finish Gold
Terminal and Terminal Block Type WIRE TERMINAL
Hole Diameter 2.7178 mm
Flange Diameter0.144 (3.66mm)
Tail Type Crimp
Accepts Pin Diameter 0.065 ~ 0.082 (1.65mm ~ 2.08mm)
Socket Depth 0.375 9.53mm
Pin Hole Diameter0.107 (2.72mm)
Length 22.5298mm
Contact Finish Thickness 30.0μin 0.76μm
Length - Overall 0.887 22.53mm
RoHS StatusROHS3 Compliant
In-Stock:3340 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$1.71000$1.71
10$1.55100$15.51
25$1.45640$36.41
50$1.39300$69.65
100$1.32970$132.97
250$1.20308$300.77
500$1.10810$554.05

About 4040-0-19-15-07-27-10-0

The 4040-0-19-15-07-27-10-0 from Mill-Max Manufacturing Corp. is a high-performance microcontroller designed for a wide range of embedded applications. This component features Circuit Board Hardware - PCB 10u AU OVER NI 07 CON.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 4040-0-19-15-07-27-10-0, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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