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370-10-120-00-001000

370-10-120-00-001000

370-10-120-00-001000

Mill-Max Manufacturing Corp.

HEADER TURRETT HEAD SIP 20POS

SOT-23

370-10-120-00-001000 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 3 Weeks
Contact MaterialBrass
Mount Through Hole
Mounting Type Through Hole
Package / Case SIP
Housing Material Polychlorinated
PackagingBulk
Published 2000
Series 370
JESD-609 Code e4
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Connector Type Header
Number of Positions 20
Color Black
Number of Rows 1
Gender Male
HTS Code8536.90.40.00
Contact Type Turret
Pitch 0.100 2.54mm
Orientation Straight
Depth 2.54mm
Contact Finish Gold
Number of Contacts 20
Max Voltage Rating (AC) 100V
Device Socket Type IC SOCKET
Length 50.8mm
Width 2.54mm
Contact Finish Thickness 10.0μin 0.25μm
RoHS StatusROHS3 Compliant
Flammability Rating UL94 V-0
In-Stock:557 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$10.402201$10.402201
10$9.813398$98.13398
100$9.257923$925.7923
500$8.733889$4366.9445
1000$8.239517$8239.517

About 370-10-120-00-001000

The 370-10-120-00-001000 from Mill-Max Manufacturing Corp. is a high-performance microcontroller designed for a wide range of embedded applications. This component features HEADER TURRETT HEAD SIP 20POS.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 370-10-120-00-001000, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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