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3302-1-14-15-00-00-08-0

3302-1-14-15-00-00-08-0

3302-1-14-15-00-00-08-0

Mill-Max Manufacturing Corp.

CONN PC PIN CIRC 0.040DIA GOLD

SOT-23

3302-1-14-15-00-00-08-0 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 5 Weeks
Contact MaterialBrass Alloy
Mount Through Hole
Mounting Type Through Hole, Right Angle
Mounting Hole Diameter 0.043 (1.09mm)
PackagingBulk
Published 2008
Series 3302
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Swage
ECCN Code EAR99
HTS Code8536.90.40.00
Contact Finish Gold
Terminal and Terminal Block Type PCB TERMINAL
Insulation Non-Insulated
Terminal TypePC Pin
Hole Diameter 1.0922 mm
Flange Diameter0.070 (1.77mm)
Terminal Style Single End
Pin Size - Above Flange 0.040 1.02mm Dia
Length 9.5758mm
Contact Finish Thickness 10.0μin 0.25μm
Board Thickness 0.031 0.79mm
Length - Below Flange 0.051 1.30mm
RoHS StatusROHS3 Compliant
In-Stock:13107 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.956000$0.956
10$0.901887$9.01887
100$0.850837$85.0837
500$0.802676$401.338
1000$0.757242$757.242

About 3302-1-14-15-00-00-08-0

The 3302-1-14-15-00-00-08-0 from Mill-Max Manufacturing Corp. is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN PC PIN CIRC 0.040DIA GOLD.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 3302-1-14-15-00-00-08-0, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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