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3232-3-00-15-00-00-08-0

3232-3-00-15-00-00-08-0

3232-3-00-15-00-00-08-0

Mill-Max Manufacturing Corp.

Circuit Board Hardware - PCB 10u AU OVER NI

SOT-23

3232-3-00-15-00-00-08-0 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 5 Weeks
Contact MaterialBrass Alloy
Contact PlatingGold
Mount Through Hole
Mounting Type Through Hole
Mounting Hole Diameter 0.062 (1.57mm)
PackagingBulk
Published 2013
Series 3232
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Swage
Contact Finish Gold
Insulation Non-Insulated
Terminal TypePC Pin
Hole Diameter 1.5748 mm
Flange Diameter0.093 (2.36mm)
Terminal Style Single End
Pin Size - Above Flange 0.040 1.02mm Dia
Length 10.033mm
Contact Finish Thickness 10.0μin 0.25μm
Length - Overall 0.395 10.03mm
Board Thickness 0.094 2.39mm
Length - Below Flange 0.125 3.18mm
Length - Above Flange 0.240 6.10mm
RoHS StatusROHS3 Compliant
In-Stock:19113 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$2.879532$2.879532
10$2.716540$27.1654
100$2.562774$256.2774
500$2.417711$1208.8555
1000$2.280859$2280.859

About 3232-3-00-15-00-00-08-0

The 3232-3-00-15-00-00-08-0 from Mill-Max Manufacturing Corp. is a high-performance microcontroller designed for a wide range of embedded applications. This component features Circuit Board Hardware - PCB 10u AU OVER NI.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 3232-3-00-15-00-00-08-0, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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