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3132-0-00-15-00-00-08-0

3132-0-00-15-00-00-08-0

3132-0-00-15-00-00-08-0

Mill-Max Manufacturing Corp.

CONN PC PIN CIRC 0.030DIA GOLD

SOT-23

3132-0-00-15-00-00-08-0 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 5 Weeks
Contact MaterialBrass Alloy
Mount Through Hole
Mounting Type Free Hanging (In-Line)
PackagingBulk
Published 2007
Series 3132
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Crimp
ECCN Code EAR99
HTS Code8536.90.40.00
Contact Finish Gold
Insulation Non-Insulated
Terminal TypePC Pin
Flange Diameter0.093 (2.36mm)
Terminal Style Wire
Pin Size - Above Flange 0.030 0.76mm Dia
Pin Size - Below Flange 0.060 1.52mm Dia
Length 10.033mm
Contact Finish Thickness 10.0μin 0.25μm
Length - Overall 0.395 10.03mm
Length - Below Flange 0.125 3.18mm
Length - Above Flange 0.240 6.10mm
RoHS StatusROHS3 Compliant
Lead Free Contains Lead
In-Stock:19821 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.28000$0.28
10$0.26100$2.61
25$0.22400$5.6
50$0.19020$9.51
100$0.18280$18.28
250$0.16412$41.03
500$0.15666$78.33

About 3132-0-00-15-00-00-08-0

The 3132-0-00-15-00-00-08-0 from Mill-Max Manufacturing Corp. is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN PC PIN CIRC 0.030DIA GOLD.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 3132-0-00-15-00-00-08-0, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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