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3121-1-00-34-00-00-08-0

3121-1-00-34-00-00-08-0

3121-1-00-34-00-00-08-0

Mill-Max Manufacturing Corp.

CONN PC PIN CIRC 0.017DIA GOLD

SOT-23

3121-1-00-34-00-00-08-0 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 5 Weeks
Contact MaterialBrass Alloy
Mounting Type Through Hole
Mounting Hole Diameter 0.023 (0.58mm)
PackagingBulk
Published 2013
Series 3121
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
HTS Code8536.90.40.00
Contact Finish Gold
Terminal and Terminal Block Type PCB TERMINAL
Insulation Non-Insulated
Terminal TypePC Pin
Hole Diameter 584.2 μm
Flange Diameter0.040 (1.02mm)
Terminal Style Single End
Pin Size - Above Flange 0.017 0.43mm Dia
Pin Size - Below Flange 0.019 0.48mm Dia
Length 5.9436mm
Contact Finish Thickness 50.0μin 1.27μm
Length - Overall 0.234 5.94mm
Board Thickness 0.025 0.64mm
Length - Below Flange 0.061 1.55mm
Length - Above Flange 0.157 3.99mm
RoHS StatusROHS3 Compliant
Lead Free Contains Lead
In-Stock:14184 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About 3121-1-00-34-00-00-08-0

The 3121-1-00-34-00-00-08-0 from Mill-Max Manufacturing Corp. is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN PC PIN CIRC 0.017DIA GOLD.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 3121-1-00-34-00-00-08-0, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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