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2530-2-00-50-00-00-07-0

2530-2-00-50-00-00-07-0

2530-2-00-50-00-00-07-0

Mill-Max Manufacturing Corp.

CONN PC PIN CIRC .040DIA TINLEAD

SOT-23

2530-2-00-50-00-00-07-0 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 5 Weeks
Contact MaterialBrass Alloy
Contact PlatingLead, Tin
Mount Through Hole
Mounting Type Through Hole
Mounting Hole Diameter 0.094 (2.39mm)
PackagingBulk
Published 2012
Series 2530
Pbfree Code no
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Swage
ECCN Code EAR99
HTS Code8536.90.40.00
Contact Finish Tin-Lead
Terminal and Terminal Block Type PCB TERMINAL
Insulation Non-Insulated
Terminal TypePC Pin
Hole Diameter 2.3876 mm
Flange Diameter0.125 (3.18mm)
Terminal Style Double End
Pin Size - Above Flange 0.040 1.02mm Dia
Length 10.7188mm
Contact Finish Thickness 300.0μin 7.62μm
Length - Overall 0.422 10.72mm
Board Thickness 0.062 1.57mm
Length - Below Flange 0.250 6.35mm
Length - Above Flange 0.151 3.84mm
RoHS StatusROHS3 Compliant
In-Stock:11395 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About 2530-2-00-50-00-00-07-0

The 2530-2-00-50-00-00-07-0 from Mill-Max Manufacturing Corp. is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN PC PIN CIRC .040DIA TINLEAD.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 2530-2-00-50-00-00-07-0, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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