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1072-1-23-21-00-00-01-0

1072-1-23-21-00-00-01-0

1072-1-23-21-00-00-01-0

Mill-Max Manufacturing Corp.

CONN PC PIN CIRC 0.072DIA GOLD

SOT-23

1072-1-23-21-00-00-01-0 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 5 Weeks
Contact MaterialBrass Alloy
Mount Press Fit, Wire
Mounting Type Through Hole
Mounting Hole Diameter 0.057 (1.45mm)
PackagingBulk
Published 2001
Series 1072
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Press-Fit, Wire Wrap
ECCN Code EAR99
HTS Code8536.90.40.00
Contact Finish Gold
Terminal and Terminal Block Type PCB TERMINAL
Insulation Non-Insulated
Terminal TypePC Pin
Hole Diameter 1.4478 mm
Flange Diameter0.072 (1.83mm)
Terminal Style Single End, Slotted
Pin Size - Above Flange 0.072 1.83mm Dia
Pin Size - Below Flange 0.025 0.64mm Square
Length 13.97mm
Contact Finish Thickness 20.0μin 0.51μm
Length - Overall 0.550 13.97mm
Length - Below Flange 0.425 10.80mm
Length - Above Flange 0.125 3.18mm
RoHS StatusROHS3 Compliant
In-Stock:11620 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About 1072-1-23-21-00-00-01-0

The 1072-1-23-21-00-00-01-0 from Mill-Max Manufacturing Corp. is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN PC PIN CIRC 0.072DIA GOLD.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 1072-1-23-21-00-00-01-0, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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