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0508-0-00-15-00-00-03-0

0508-0-00-15-00-00-03-0

0508-0-00-15-00-00-03-0

Mill-Max Manufacturing Corp.

CONN PC PIN CIRC 0.020DIA GOLD

SOT-23

0508-0-00-15-00-00-03-0 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 5 Weeks
Contact MaterialBrass Alloy
Mount Surface Mount
Mounting Type Surface Mount
Package / Case SMD/SMT
PackagingBulk
Published 2011
Series 0508
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
HTS Code8536.90.40.00
Contact Finish Gold
Terminal and Terminal Block Type PCB TERMINAL
Insulation Non-Insulated
Terminal TypePC Pin
Flange Diameter0.058 (1.47mm)
Terminal Style Single End
Pin Size - Below Flange 0.020 0.51mm Dia
Length 3.937mm
Contact Finish Thickness 10.0μin 0.25μm
Length - Overall 0.155 3.94mm
Length - Above Flange 0.125 3.18mm
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:43538 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.14000$0.14
10$0.13200$1.32
25$0.09800$2.45
50$0.08420$4.21
100$0.08130$8.13
250$0.07012$17.53
500$0.06730$33.65

About 0508-0-00-15-00-00-03-0

The 0508-0-00-15-00-00-03-0 from Mill-Max Manufacturing Corp. is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN PC PIN CIRC 0.020DIA GOLD.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 0508-0-00-15-00-00-03-0, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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