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MXLPUTLAD30KP75A

MXLPUTLAD30KP75A

MXLPUTLAD30KP75A

MICROSEMICORPORATION

MXLPUTLAD30KP75A datasheet pdf and Card Guides product details from MICROSEMICORPORATION stock available on our website

SOT-23

MXLPUTLAD30KP75A Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time ACTIVE (Last Updated: 6 days ago)
Lifecycle Status 6 Weeks
Mount Cable, Free Hanging
Mounting Type Surface Mount
Package / Case SOIC
Number of Pins 3
Operating Temperature 0°C ~ 125°C
Packaging Tape & Reel (TR)
Pbfree Code yes
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 3
ECCN Code EAR99
Temperature Coefficient -
Subcategory Operational Amplifier
Voltage - Supply 10V ~ 40V
Base Part Number Guf Yrpf
Output Voltage 78 V
Output Type -
Interface I2C, SPI
Termination Type SOLDER
Operating Supply Current 1.5 mA
Nominal Supply Current 700 μA
Output Current 60 mA
Max Supply Current 800 μA
Slew Rate 0.3V/μs
Architecture VOLTAGE-FEEDBACK
Amplifier Type General Purpose
In-Stock:3481 items

About MXLPUTLAD30KP75A

The MXLPUTLAD30KP75A from MICROSEMICORPORATION is a high-performance microcontroller designed for a wide range of embedded applications. This component features MXLPUTLAD30KP75A datasheet pdf and Card Guides product details from MICROSEMICORPORATION stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the MXLPUTLAD30KP75A, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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