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BR23UT1112A212V

BR23UT1112A212V

BR23UT1112A212V

MICROSEMICORPORATION

BR23UT1112A212V datasheet pdf and Evaluation, Development Board Enclosures product details from MICROSEMICORPORATION stock available on our website

SOT-23

BR23UT1112A212V Datasheet PDF

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Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time ACTIVE (Last Updated: 3 days ago)
Lifecycle Status 12 Weeks
Mount Cable, Free Hanging
Mounting Type Surface Mount
Package / Case TQFP
Number of Pins 9
Operating Temperature -40°C ~ 110°C
Packaging -
Pbfree Code -
Part Status Last Time Buy
Moisture Sensitivity Level (MSL) -
Number of Terminations 8
ECCN Code -
Temperature Coefficient POSITIVE ppm/°C
Subcategory -
Voltage - Supply 8V ~ 36V
Base Part Number Pkhxls Ysjoen
Output Voltage 12 V
Output Type N-Channel
Interface -
Termination Type SOLDER
Operating Supply Current 1 mA
Nominal Supply Current 1 mA
Output Current 90 mA
Max Supply Current 1 mA
Slew Rate -
Architecture VOLTAGE-FEEDBACK
Amplifier Type OPERATIONAL AMPLIFIER
In-Stock:2415 items

About BR23UT1112A212V

The BR23UT1112A212V from MICROSEMICORPORATION is a high-performance microcontroller designed for a wide range of embedded applications. This component features BR23UT1112A212V datasheet pdf and Evaluation, Development Board Enclosures product details from MICROSEMICORPORATION stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the BR23UT1112A212V, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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