MPF300TL-FCG1152I Overview
In the 1152-BBGA, FCBGA package, you will find fpga chips. Fpga chips is programmed wFpga chipsh 512 I/Os for transferring data in a more coherent manner. A fundamental building block consists of 300000 logic elements/cells. The Surface Mount-slot connector on the FPGA module can be connected to the development board. This device is powered by a 0.97V~1.08V battery. This is a type of FPGA that is part of the PolarFire? series of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. This FPGA model is contained in Tray for space saving. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 21094400 bFpga chipss. It employs 1152-FCBGA (35x35) as its supplier device package.
MPF300TL-FCG1152I Features
512 I/Os
Up to 21094400 RAM bits
MPF300TL-FCG1152I Applications
There are a lot of Microsemi Corporation MPF300TL-FCG1152I FPGAs applications.
- Wired Communications
- Automotive driver's assistance
- DO-254
- Automation
- Software-defined radios
- Electronic Warfare
- Telecommunication
- Military Temperature
- High Performance Computing
- Embedded Vision
