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MPF200TL-FCSG325E

MPF200TL-FCSG325E

MPF200TL-FCSG325E

Microsemi Corporation

FPGAs PolarFire? Series 324-LFBGA

SOT-23

MPF200TL-FCSG325E Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Mounting Type Surface Mount
Package / Case 324-LFBGA
Supplier Device Package 325-FPGA (11x11)
Operating Temperature0°C~100°C TJ
PackagingTray
Series PolarFire™
Part StatusActive
Voltage - Supply 0.97V~1.08V
Number of I/O 170
Number of Logic Elements/Cells 192000
Total RAM Bits 13619200
RoHS StatusRoHS Compliant
In-Stock:63 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$350.89000$350.89

MPF200TL-FCSG325E Product Details

MPF200TL-FCSG325E Overview


The package that contains this software is called 324-LFBGA. There are 170 I/Os for better data transfer. There are 192000 logic elements/cells to form a fundamental building block. FPGA modules can be attached to development boards using a Surface Mount-connector. In order for it to operate, the supply voltage must be 0.97V~1.08V . The FPGA belongs to the PolarFire? series of FPGAs, and it is one type of FPGA. Operating temperatures should be maintained within the 0°C~100°C TJ range at all times when the unit is in use. It is for space saving reasons that this FPGA model is contained in Tray. As far as the RAM bits are concerned, this device offers you a total of 13619200. Its supplier package is called 325-FPGA (11x11).

MPF200TL-FCSG325E Features


170 I/Os
Up to 13619200 RAM bits

MPF200TL-FCSG325E Applications


There are a lot of Microsemi Corporation MPF200TL-FCSG325E FPGAs applications.

  • Telecommunication
  • Software-defined radio
  • Data center search engines
  • Aerospace and Defense
  • Video & Image Processing
  • Radar and Sensors
  • Automotive
  • Solar Energy
  • Ecosystem
  • Development Boards and Shields for Microcontrollers

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